Vertical Electroless Copper | Metallization | …
M-System integrated Desmear – Electroless Copper combines a statistically developed and proven primary metallization system to fit the needs of the Printed Circuit Board industry. The first stage of the process is a stone Desmear process designed for today’s variety of special resin systems. The process can be tailored to run in vertical or horizontal equipment for everything from high ...
Horizontal Electroless Copper | Products | …
MacDermid Enthone M-Copper EF is the only electroless copper system on the market that is sold by an international plating supplier which can outperform local suppliers at a competitive price.M-Copper EF is specifically formulated from decades of experience with electroless copper plating and modern innovations to allow for a revolution in quality and service in a segment of the PCB industry ...
Circuposit 6500 Horizontal Electroless Copper …
To meet these challenges, Dupont has created the Circuposit™ 6500 Horizontal Electroless Copper System, based on an Ionic Catalyst and a Tartrate-based Electroless copper for ELIC and IC Substrate applications. Key Features of the process:
Horizontal Electroless Copper System - Line Plating …
Model 990D Electroless Copper System Chemcut > Conveyorized Plating > Model 990D Electroless Copper System A new market-sized Horizontal Electroless Copper Processing System designated the Model 990D is just 41′ long and 71″ wide, the system is designed to fit the needs of current North American plating operations.
Equipment (Electronics) | Atotech
With decades of experience in horizontal wet-chemical electroless copper systems, Atotech has developed the new high-speed electroless copper systen consisting of CupraTech ® FPD process and VisioPlate ®. It is tailored to the requirements of the next generation products of the flat panel display industry. The VisioPlate ® tool features:
Meeting the horizontal electroless copper plating …
Meeting the horizontal electroless copper plating challenge. Feng Liu. Dow Electronic Solutions R&D scientist, Interconnect Technologies Liu’s research interests are ionic and nanoparticle catalyst, electroless and electrolytic copper metallization, and electrolytic nickel metallization.
Horizontal Electroless Copper阿托科技股份有限公 …
Horizontal Electroless Copper . Model: Printoganth SAP Plus, U, U Plus, P Plus. Category: Materials and Chemicals for PCB / Chemicals for PCB / Alkaline Palladium Base Electro-Less Copper Process Characteristics . Printoganth SAP Plus process chemistry in combination with Uniplate equipment gives superior adhesion on bare resins coupled with an extremely good surface distribution. This makes ...
Electroless copper deposition - Eurocircuits
We use electroless copper, that is we deposit chemically a layer of copper about 1 micron thick over the walls of the hole (and incidentally across the whole panel). This is a multi-stage process as you see from the video with washing steps between the stages.
Electroless Copper Plating | Surface Engineering ...
Electroless, or autocatalytic, metal plating is a nonelectrolytic method of deposition from solution that can be plated uniformly over all surfaces, regardless of size and shape. The platings ability to plate onto nonconductors is an advantage that contributes to the choice of electroless copper …
Desmear and metallization | Atotech
“Atotech’s core competence is making dielectric surfaces conductive. As the inventor and market leader of horizontal electroless Copper processes, we know best how to develop and fine-tune our products to fulfill the highest requirements of our existing and potential customers.”
PC Electroless Copper | Transene
PC Electroless Copper allows the electroless deposition of copper onto dielectric and non-conducting surfaces such as glass, ceramic, and stone including through-hole deposition.
REPRINTED WITH PERMISSION FROM CIRCUPOSIT™ 6530 Catalyst ...
initiation of electroless copper metallization. This stone presents the development of a new ionic palladium catalyst, CIRCUPOSIT™ 6530 Catalyst, 1 which is being commercialized by Dow Electronic Materials to meet the reliability performance demands of HDI and PKG substrates in horizontal electroless copper plating.
Properties of electroless Cu films optimized for ...
Properties of electroless Cu films optimized for horizontal plating as a function of deposit thickness. ... F. Brüning, J. EtzkornStrain in electroless copper films monitored by x-ray diffraction during and after deposition and its dependence on bath chemistry. Thin Solid …
Horizontal electroless copper line - gz-julong.com
Horizontal electroless copper line. 1 Product description 2 Product partial picture 3 Product Specifications 01Product description. 02Product partial picture. No product image yet. 03Product Specifications. Horizontal electroless copper line: Panel size(FPC) 500mmW*500mmL (max)
CHEMCUT, ATOTECH ANNOUNCE RELEASE OF …
March 09, 2006. FOR IMMEDIATE RELEASE March 9, 2006. CHEMCUT, ATOTECH ANNOUNCE RELEASE OF NEW HORIZONTAL ELECTROLESS COPPER PROCESSING SYSTEM. State College, PA Chemcut Corporation and Atotech USA, Inc. announce the release of a new market-sized Horizontal Electroless Copper Processing System designated the Model 990D.
Chapter Electroless Copper In Printed Wiring Board Fabrication
Electroless Copper in Printed Wiring Board Fabrication 335 Fig. 13.4-Smear removal. In wet sanding (Fig. 13.2), care must be taken not to apply too much pressure at this step, to avoid rounding the corner of the hole and exposing bare dielectric
Electroless Copper Plating Process Applicable to ...
Electroless Copper Plating Process Applicable to Horizontal System. ... Use for electroless copper plating by horizontal conveyance system Cyanide-free, rochelle salt base product Can show high deposition performance quickly High bath stability, not cause …
Custom Tag: Treatment Chemicals for Electroless …
Use for electroless copper plating by horizontal conveyance system Cyanide-free, rochelle salt base product Can show high deposition performance quickly High bath stability, not cause bristers on low surface roughness substrates